IC Package and Footprint Conversion
IC Package and Footprint Conversion
Device Re-targeting
Obsolescence brings with it great uncertainty. A last-time-buy notice requires you to forecast usage for the remaining production and service life of your equipment while unplanned re-design introduces disruption not accounted for in project budgets and departmental hours. Winslow solutions harness our extensive knowledge of electronic hardware & software design and interconnect to reconfigure this…
Reverse Engineering
Our Reverse Engineering service extends to reviewing hard copy drawings for material and treatment processes in line with the EU REACH regulations, scanning complex forms to an accuracy of 5 microns where drawings no longer exist and manufacturing a minimum order quantity of just one part using CNC Machining, 3D Printing, Plastic Moulding or Casting. This helps companies combat issues of Obsolescence and Allocation.
Connectors
Winslow continue to maintain tooling for legacy connectors and will cross refer to most manufacturers part number and/or drawings to support numerous businesses.
