Emulation & Test Interface

Our Emulation and Test Interface components are solder down modules to suit any package type provides a cost-effective solution for replacement test heads, male or female. The mating top modules can incorporate either a ZIF or standard IC socket and the addition of optional test pins if required from RS Components.

IC Test Socket Adapters

Test Socket Breakout Adapters convert Test sockets to a male 0.1" PGA type footprint.

SOP, SSOP, TSOP, QFP, PQFP,TQPF, BQFP & PLCC

TSOP SOLDER DOWN MODULE

This range of modules allows the user to test and develop. The assembly of these modules is designed to solder the TSOP solder down onto existing target lands and breaks out each signal to male pins on the top side. This enables easy interface to the adapter.

Business as Usual

Please be assured that as the COVID-19 pandemic is impacting all of us, we continue to operate on a ‘business as usual’ basis. Some of our team will be assisting you remotely while our factory staff adhere to the governments social distancing regulations.

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