Archives: Products
Prototyping Adapters/Interposers
Prototyping adapters breakout from any package type to 2.54mm pitch pins or a larger pitch SMT footprint to solder to your development board. Our extensive design library means that many are available for fast delivery or next day from RS Components. Find out more about our Prototyping Adapters/Interposers products below. Looking for more information on…
QFN to PGA
These Prototyping Adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The adapter features a surface mount pad on the top which can be soldered to the surface mount device. The underside of the adapter has male PGA pins on 2.54mm pitch which can be soldered into a…
SOP to DIP
These Prototyping Adapters convert the footprint of a SOIC, SOJ, SSOP, TSOP & TSSOP to DIP for development, supply chain shortages & obsolescence. The adapter features surface mount pads for soldering surface mount device to the top of the adapter. The underside features male DIP pins on 2.54mm pitch which can either be soldered into…
IC Package and Footprint Conversion
IC Package and Footprint Conversion
PLCC Pads to DIL
PLCC Pads to PGA
QFP TO PGA W/ SOCKET
DIP Reducer
PLCC Pads to DIL
Winslow Adaptics complete range of adapters converts PLCC devices to alternative footprints. This is achieved through male pins on the underside which replicate a DIL package.
