Please select one of the following adapter types:

 

Production PLCC socket on the top and male pins on the underside to mate with a DIP socket or solder into a DIP hole array

 
 

PLCC pad array on the top and male pins on the underside to mate with a DIP socket or solder into a DIP hole array

 
 

SOP pad layout on the top and male pins on the underside to mate with a DIP socket or solder into a DIP hole array

 
 

DIP socket pins on the top and male pins on the underside to mate with a DIP socket or solder into a DIP hole array. The DIP pitch on the top is different to that on the bottom, allowing the use of, for example, a 0.3" DIP device in a 0.6" DIP socket

 
 

QFN pad array on the top and male pins on the underside to mate with a DIP socket or solder to a DIP hole array

 
 

 

                                   

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